Virginia Microelectronics Center

Manufacturer
System Design and Fabrication Inc.

E-beam and thermal deposition system

Equipment Statistics

Minimum deposition rate 0.1 - 0.5 Å/s (material dependent when using Auto function), manual deposition is available
Crucible Holder 6 different materials, 1 material available to deposit at a time
Current materials Al, Al/Si, Cu, Cr, Au, SiO2, Zn, Ni, Ti, Co, Ge, HfO2, Hf, Mo, SnO, MgF2
Thin film thickness range 10s – 100s of nanometers